集成电路封装材料的表征 英文2025|PDF|Epub|mobi|kindle电子书版本百度云盘下载

集成电路封装材料的表征 英文PDF格式电子书版下载

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IC PACKAGE RELIABILITY TESTING1

1.1 Introduction1

1.2 In-Process Quality Measurements2

Wire Bond Quality3

Die Attach Quality4

Other Process Control Measurements8

1.3 Package-Oriented Reliability Testing of Finished Devices:Moisture Testing10

Failure Analysis of Moisture-Related Failures11

Root Causes of Corrosion Failures12

1.4 Package-Oriented Reliability Testing of Finished Devices:Thermal Cycle Testing14

Bond Failures:Bond Pad Contamination16

Intermetallic Formation and Other Elements of Bond Formation18

1.5 Reliability Test Preconditioning:A New Direction23

1.6 Summary25

MOLD COMPOUND ADHESION AND STRENGTH27

2.1 Introduction27

2.2 Thermodynamic Consideration of Adhesion28

Work of Adhesion28

The Work of Adhesion from Contact Angle Measurements30

Work of Adhesion in the Presence of Moisture and Lubricants30

2.3 Adhesive Strength for Various Mold Compound Types31

Adhesive Strength Measurements31

Mold Compound Types31

Adhesive Strength of Various Mold Compounds32

2.4 Various Factors Which Influence Adhesion Strength33

Effects of Lead Frame Oxides34

Effects of Different Lead Frame Materials38

Effects of Adhesion Promoters40

Effects of Various Mold Release and Processing Aids41

Effects of Mold Compound Rheology42

2.5 Role of Adhesion in Surface Mount Operations43

Moisture Absorption and Its Effect on Adhesion45

Package Delamination and Cracking in VPR and SDIP45

2.6 Role of Adhesion in Package Reliability48

Metal Line Movement48

Highly Accelerated Stress Test(HAST)49

2.7 Physical Characterization of Mold Compounds49

Physical Properties of Various Mold Compounds49

Cure Kinetics51

2.8 Outlook for Future Mold Compounds53

2.9 Summary54

MECHANICAL STRESS IN IC PACKAGES57

3.1 Introduction57

3.2 Stress and Strain Relations:An Overview58

3.3 Stress Generation in IC Packages61

3.4 Tools for Stress Determination in IC Packages63

Finite Element Analysis64

Strain Gauges for Stress Analysis64

Moire Interferometry64

Indirect Stress Determination64

3.5 Application of Techniques to IC Packaging Problems64

Eutectic Die Attach65

Passivation Damage at Chip Corners66

Ball Bond Stresses68

Solder Reflow Damage69

Tape Automated Bonding Inner Lead Stresses72

Filler Particle-Induced Damage73

Mechanical Warpage73

Mechanical Damage74

Parametric Shifts Related to Package Stresses74

3.6 Solder Joint Stress and the Coffin-Manson Relation75

3.7 Summary76

MOISTURE SENSITIVITY AND DELAMINATION79

4.1 Introduction79

4.2 Moisture/Reflow Sensitivity Evaluations81

Moisture Sensitivity Classification81

Moisture Absorption:Preconditioning83

Solder Reflow Damage85

4.3 Impact on Temperature-Cycle Performance91

4.4 Impact on THB Performance92

4.5 Moisture Desorption:Bake-Out93

4.6 Summary94

THERMAL MANAGEMENT97

5.1 Introduction97

5.2 IC Package Thermal Characteristics99

5.3 Factors Affecting Package Thermal Resistance105

Package Design105

Package Material Thermal Conductivity107

Die Attach Material111

Package Size and Die Size Effects111

Package Defects112

PCB Effect on Thermal Performance113

The Effect of Neighboring Components114

Heat Fins115

5.4 Thermal Design Challenges of Multi-Chip Modules115

5.5 Summary116

ELECTRICAL PERFORMANCE OF IC PACKAGES121

6.1 Introduction121

6.2 Designing for Performance123

6.3 Electrical Models for Packages and Interconnects125

Low Frequency Models125

6.4 Propagation Delay and Packaging127

Clock Frequency,Bandwidth,and Rise Time127

Propagation Delay128

RC Delay128

Time of Flight128

6.5 Switching Noise130

6.6 Signal Integrity134

6.7 Crosstalk135

6.8 Materials and Design Trends for High-Performance Packaging138

6.9 Summary143

SOLDERABILITY OF INTEGRATED CIRCUITS145

7.1 Introduction145

7.2 Electronic Soldering Basics146

Soldering Definitions146

Solder Joints for Electronic Packages147

Solderability Defect Classifications147

7.3 IC Package Designs,Materials,and Solderability Test Methods148

Through-Hole Package Designs and Materials148

Surface Mount Package Designs and Materials150

Tape Automated Bonding Package Design and Materials152

7.4 IC Solderability Defects152

Through-Hole Solderability Problems152

SMT Solder Electroplating Process Defects155

SMT Lead Finish Defects158

SMT Solderability Problems Due to Mechanical Damage159

TAB Solderability Problems161

7.5 Solderability of IC Packages to PCBs162

Printed Circuit Boards162

Electronic Solders,Fluxes,and Pastes163

7.6 Summary165

HERMETICITY AND JOINING IN CERAMIC IC PACKAGES167

8.1 Introduction167

8.2 Materials for Hermetic IC Packaging169

8.3 Hermeticity Testing—History173

8.4 Theory of Hermeticity Testing174

8.5 Gross-Leak Testing Methodology177

8.6 Hermeticity Failure Analysis178

8.7 Alternatives to Hermetic Packaging182

8.8 Summary183

ADVANCED INTERCONNECT TECHNOLOGY187

9.1 Introduction187

9.2 MCM Technology Classifications188

9.3 MCM Materials Selection190

Substrate Materials and Design191

Polyimide Dielectrics194

Test Substrates195

Power Density196

9.4 Die Mounting and Stress198

Die Bond Adhesive Strength199

Flip-Chip Technology200

9.5 Die Interconnection201

Wire Bond Technology201

Bond Optimization203

9.6 MCM Packages204

Substrate-Based Packages204

9.7 Summary205

APPENDIX:TECHNIQUE SUMMARIES209

1 Acoustic Microscopy(C-AM)209

2 Atomic Absorption Spectrometry(AAS)213

3 Auger Electron Spectroscopy(AES)214

4 Ceramic Plate Test(CPT)for Evaluating Solderability of IC Devices215

5 Coulometric Method for Solderability Evaluation218

6 Decapsulation Techniques222

7 Differential Scanning Calorimetry(DSC)225

8 Dynamic Mechanical Analysis227

9 Dynamic Secondary Ion Mass Spectrometry(Dynamic SIMS)229

10 Electron Probe X-Ray Microanalysis(EPMA)230

11 Energy-Dispersive X-Ray Spectroscopy(EDS)231

12 Finite Element Analysis(FEA)232

13 Fourier Transform Infrared Spectroscopy(FTIR)235

14 Inductively Coupled Plasma Mass Spectrometry(ICPMS)236

15 Inductively Coupled Plasma-Optical Emission Spectroscopy(ICP-OES)237

16 In Situ Strain Gauges238

17 Ion Chromatography240

18 Mechanical Testing in IC Packaging243

19 Scanning Electron Microscopy(SEM)247

20 Scanning Tunneling Microscopy(STM)and Scanning Force Microscopy(SFM)248

21 Static Secondary Ion Mass Spectrometry(Static SIMS)249

22 Thermogravimetric Analysis(TGA)250

23 Thermomechanical Analysis(TMA)252

24 Torsional Braid Analysis(TBA)255

25 Wetting Balance Method to Evaluate the Solderability of IC Devices258

26 X-Ray Laminography260

27 X-Ray Photoelectron Spectroscopy(XPS)263

28 X-Ray Radiographic Inspection264

Index267